超高精度倒裝芯片貼片機(jī) CB-700特點(diǎn)：? Ultra-low load, high-accuracy bonding? Real-time control is possible in the low load range. As a result, bump height variation become minimized.
Product Details
超高精度倒裝芯片貼片機(jī) CB-700特點(diǎn)：
? Ultra-low load, high-accuracy bonding
? Real-time control is possible in the low load range. As a result, bump height variation become minimized.
